UTM strengthens Japan-Malaysia research collaboration through TCU seminar

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📝 Summary

The International Research Seminar “Advanced Electronics Devices and Communications Technology 2026” was held at Tokyo City University, Japan, strengthening Japan-Malaysia research collaboration. The seminar brought together 19 invited speakers from Malaysia and Japan, representing various universities, to exchange knowledge and research ideas. The event aimed to foster joint research activities and future initiatives in advanced electronics and communications technology.

SETAGAYA, Oct 6 – The International Research Seminar “Advanced Electronics Devices and Communications Technology 2026” was held on 6 October 2026 at the Setagaya Campus of Tokyo City University (TCU), Japan. The one-day hybrid seminar was organised by the International Centre, TCU, with support from the Department of Electrical, Electronics and Communication Engineering, Faculty of Science and Engineering, TCU.

A group photo of on-site and virtual participants at the Seminar Room, Building 10, Setagaya Campus, Tokyo City University, Tokyo, Japan

The seminar was initiated by MJIIT, UTM Visiting Associate Professor, Assoc. Prof. Dr. Sumiaty Ambran as part of her academic and research activities at Tokyo City University.

The seminar commenced with an opening remark by the Dean of the Graduate School of Integrative Science and Engineering, Prof. Dr. Hiroshi Nohira, who welcomed the participating researchers and postgraduate students. In his remarks, Prof. Nohira emphasised the value of international academic exchange, stating,

“I hope that today’s seminar will be a meaningful platform for knowledge exchange, friendship, and long-term Malaysia–Japan research collaboration, and that the discussions we begin today will lead to many exciting joint research activities in the future.”

Welcome remarks by Prof. Hiroshi Nohira, Dean of the Graduate School of Integrative Science and Engineering

A total of 19 invited speakers from Malaysia and Japan participated in the seminar, representing TCU, the National Institute of Information and Communications Technology (NICT), Universiti Teknologi Malaysia (UTM), Universiti Putra Malaysia (UPM), Universiti Kebangsaan Malaysia (UKM), and Universiti Sains Malaysia (USM). Approximately 40 researchers and postgraduate students took part in the hybrid programme, contributing to an active exchange of knowledge and research ideas.

Parallel session of the communication track chaired by Prof. Tomoaki Yoshida

The seminar featured presentations covering research areas including semiconductor devices, optical and optoelectronic devices, fiber-optic sensing, wireless and optical communications, photonics, advanced materials, and emerging communication technologies. The diversity of topics highlighted the complementary expertise of researchers working across advanced electronics and communications.

Hybrid presentation at the semiconductor and optical devices track chaired by Assoc. Prof. Yusuke Hoshi

Beyond the technical presentations, the programme provided opportunities to identify common research interests, complementary expertise, potential joint research projects, and future grant applications. These outcomes align with UTM’s ASCEND 2030 aspirations, particularly in strengthening international engagement, research excellence, global networks, international research funding, and academic mobility.

The seminar also served as a platform for researchers to share knowledge, establish new academic connections, and explore future initiatives in advanced electronics, photonics, sensing, semiconductor devices, and communication technologies. The engagement contributes to enhancing the international visibility and research impact of participating institutions, while supporting continued efforts to develop high-impact research and global academic partnerships.

The discussions further highlighted opportunities for continued Malaysia–Japan collaboration through joint research, academic exchange and future initiatives in advanced electronics and communications technology.

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