Disember 4, 2024

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MDEC Announces Collaboration with UTM on MyIndustry AI Scholarship Program

Kuala Lumpur, 12 September 2019 – During the Next Big Tech Asia 2019 which is an anchor event of AI and Data Week 2019, YB Gobind Singh Deo introduced the MYINDUSTRY AI Scholarship Programme, a masters by research in AI scholarship jointly funded by the industry, university and Malaysia Digital Economy Corporation (MDEC). The pilot scholarship programme will cover a minimum monthly stipend of RM2,500 up to 24 months and tuition fees. Participating universities include University of Malaya (UM) , Universiti Teknologi Malaysia (UTM) and Multimedia University (MMU). The pioneer companies supporting this scholarship are Astro, Celcom, CIMB, Commerce.Asia, Green Packet Bhd, G3 Global Bhd, Iris Corporation Bhd and Poladrone.

 

 The participants of the MyIndustry AI Scholarship from UTM, UM, MMU with MDEC team and YB Gobind Singh Deo

The UTM team from Razak Faculty of Technology and Informatics and School of Computing that participated in the launching program

 

To develop more industry relevant talent, UTM acknowledged the support from 7 industry partners that provide a one year placement for their pioneer batch of students under the 2u2i mode programme for Bachelor of Computer Science (Data Engineering). The objective of this programme is to provide students with greater exposure to real working experience through more learning time in the industry. The industry partners are Datamicron, DHL Asia Pacific Shared Services, IJM Corporation, Petronas, PPG Coatings, TM One and Top Glove.

The participants of the 2u2i mode programme for Bachelor of Computer Science (Data Engineering) program with MDEC team and YB Gobind Singh Deo.

 

 

 

 

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